Xuejun Fan, Ph.D

About Me

fan photo 2018

Xuejun Fan is currently a professor in the Department of Mechanical Engineering at Lamar University, Beaumont, Texas. Dr. Fan received a B.S. degree in Applied Mechanics and an M.S. degree in Solid Mechanics from Tianjin University in 1984 and 1986, respectively. In 1989 he earned a Ph.D. degree in Solid Mechanics from Tsinghua University.

 

From 1989 to 1997, Dr. Fan was a member of the faculty at Taiyuan University of Technology (TUT) in China. He received an early promotion to full professor at the age of 27 in 1991, and became one of the youngest professors in nation that time. From 1993 to 1994, he was a JSPS Research Fellow at the University of Tokyo in Japan. From 1996 to 1997, he was a visiting professor at the University of British Columbia, Canada. Dr. Fan served as Director of Institute of Applied Mechanics at TUT from 1994 to 1997, and established a PhD program in biomedical engineering.

Between 1997 and 2007, Dr. Fan gained significant experience in the microelectronics industry. From 1997 to 2000, he was a Member of Technical Staff with the Institute of Microelectronics in Singapore; from 2000 to 2004, he was a Senior Member of Research Staff at Philips Research in Briarcliff Manor, New York; and from 2004 to 2007, he was a Senior Staff Engineer with Intel Corporation, Chandler, Arizona. He has been recognized as an expert in the field of packaging reliability and modeling in electronic packaging community, and has made significant contributions in several areas.

Dr. Fan joined Lamar University in 2007 as an associate professor. He became a full professor in 2013 by early promotion. 

Dr. Fan’s current areas of expertise include characterization, modeling and reliability of materials, components, and systems in micro- and opto-electronics manufacturing and packaging. He has published 4 books, 25 book chapters, and over 250 technical papers in the area of the manufacture, packaging and reliability of microelectronics packaging, biomechanics and solid mechanics. Dr. Fan a named inventor on several patents.

Dr. Fan is elected as a member-at-large to the IEEE Electronic Packaging Society (EPS) Board of Governors in 2017.  He is also appointed as a member at large of the ECTC Steering Committee. He is an Associate Editor of the IEEE Transactions of Components, Packaging and Manufacturing Technology. He is an IEEE Distinguished Lecturer since 2008. He has organized sessions and served as a chair or co-chair at various EPS conferences. He has been a Co-Chair and Program Chair of the International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP) since 2009.   

Dr. Fan has been recognized through various awards and honors. At Lamar University, he received University Professor Medal in 2018, the highest honor at Lamar University. He received University Scholar Award in 2017. He is Larry Lawson Research Fellow (2017-2020), Distinguished Faculty Research Fellow (2015-2018, 2018-2021), and Presidential Faculty Fellow (2014-2016). He was also selected as Inaugural Faculty Mentor Award in 2015.

Dr. Fan is 2019 IEEE Fellow. He received the Outstanding Sustained Technical Contribution Award in 2017, and Exceptional Technical Achievement Award in 2011, from the IEEE Electronic Packaging Society.

In his early academia career in China, Dr. Fan was the recipient of a Young Faculty Award from the Fok Ying-Tung Education Foundation, Hong Kong in 1994. He received the nominee for the title of “Ten Outstanding Youth of China” in 1991.

 

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