Jenny Zhou, Ph.D

Publications

Peer-Reviewed Journal Papers 

  1. Chen LB, Zhou J, Chu HW, Zhang GQ, Fan XJ. A Review on Water Vapor Pressure Model for Moisture Permeable Material Subjected to Rapid Heating. Applied Mechanics Review, 2018 DOI:10.1115/1.4039557
  2. Yao, C. L. Lai, J. L. Alvarado, J. Zhou, K. T. Aung, J. E. Mejia, “Experimental study on effect of surface vibration on micro textured surfaces with hydrophobic and hydrophilic materials,” Applied Surface Science 412, 45-51, 2017
  3. Chen LB, Zhou J, Chu HW, Zhang GQ, Fan XJ. Modeling Nonlinear Moisture Diffusion in Inhomogeneous Media. Microelectronics Reliability. 75 (2017) 162–170. 2017
  4. Kijkanjanapaiboon K, Xie M, Zhou J, Fan XJ. Investigation of Dimensional and Heat Source Effects in Lock-In Thermography Applications in Semiconductor Packages. Applied Thermal Engineering 113 (2017) 673–683. 2017
  5. Kallolimath S., and J. Zhou, “Optimal Shock Pulse in a Drop Test Simulation of Standardized Board for Uniform Shock Response,” ASME Journal of Electronic Packaging, 138 (4). 2016, doi: 10.1115/1.4034187.
  6. Shen Y, Zhang L. Zhu WH, Zhou J, Fan XJ. Finite-element analysis and experimental test for a capped-die flip-chip package design, IEEE Transactions on Components, Packaging and Manufacturing Technology. 6(9), 1308 – 1316. 2016
  7. Zhu LS, J. Zhou, and X. Fan, “Rupture and Instability of Soft Films due to Moisture Vaporization in Microelectronic Devices,” Journal of Computers, Materials and Continua, vol.39, no.2, pp.113-134, 2014
  8. Patki, X. Li, D. Chen, and J. Zhou, etc., “On Numerical Simulation of Black Carbon (Soot) Emissions from Non-Premixed Flames,” Journal of Geoscience and Environment Protection, 2014, 2, 15-24
  9. Zhu, WH, Aung, K., and Zhou J., “An Investigation on 3D Haptic-augmented Learning Tools for Dynamics, ” IEEE Transection on Haptics, in review, 2014
  10. Li, G. Subbuswamy, and J. Zhou, “Performance of Gas Turbine Film Cooling with Backward Injection,” Energy and Power Engineering, 5, 132-137, 2013
  11. Zhu, WH, Aung, K., and Zhou J., “3D Haptic-augmented Learning Tools for Rigid Body Dynamics,” Virtual Reality, 2014
  12. Li, X., Zhou, J., and Aung, K., “On selection of reference temperature of heat transfer coefficient for complicated flows,” Heat and Mass Transfer, v 45, n 5, pp. 633-643, 2009.
  13. Zhou, J., “Transient analysis on hygroscopic swelling characterization using sequentially moisture diffusion and hygroscopic stress modeling method,” Journal of Microelectronic Reliability, pp. 805-810, Vol. 48, 2008
  14. Zhou, J. and Law J. S., “Effect of nonuniform moisture distribution on the hygroscopic swelling coefficient,” IEEE Transactions on Component and Packaging Technologies, 269-276, Vol. 31, June 2008
  15. Zhou, J. and Farquhar, T., “A study on the local buckling and Brazier collapse of anisotropic thin wall tubular structures,” ASME Journal of Applied Mechanics, 2009
  16. Tee, T. Y., Ng., H. S., Zhong, Z. W., and Zhou, J. , “Board level solder joint reliability analysis of thermally enhanced BGAs and LGAs,” IEEE Transactions on Advanced Packaging, 29, No. 2, pp. 284-290, 2006
  17. Zhang, X. R., Tee, T. Y., and Zhou J., “Novel process warpage modeling of matrix stacked die BGA," IEEE Transactions on Advanced Packaging, 29, No. 2, pp. 232-239, 2006
  18. Luan, J.-E., Tee, T. Y., and Zhou, J., “Advanced numerical and experimental techniques for analysis of dynamic responses and solder joint reliability during drop impact,”  IEEE Transactions on Component and Packaging Technologies, 29, No. 3, pp. 449-456, 2006
  19. Tee, T. Y., Ng., H. S., and Zhou, J. “Design analysis and optimization of wafer-level CSP board level solder joint reliability,” Journal of Surface Mount Technology, 18(3), pp 26-31 2005
  20. Zhou, J. and Farquhar, T., “Reference basis model updating method used to find material properties of living structures in vivo,Journal of Sound and Vibration, Vol. 285/4-5, pp 1109-1122, 2005
  21. Fan, X, Zhou J., Zhang, G. Q., and, Ernst L. J. “A micromechanics-based vapor pressure model in electronic packages,” ASME Journal of Electronics Packaging, Vol. 127, pp 262-267, 2005
  22. Fan XJ, Zhou J. and Zhang, G. Q., “Multi-physics modeling in virtual prototyping of electronic packages - combined thermal, thermo-mechanical and vapor pressure modeling,” Journal of Microelectronics Reliability, 44, 1967–1976, 2004
  23. Farquhar, T., Zhou, J., and Wood, W. H., “Competing effects of buckling and anchorage strength on optimal wheat stalk geometry,” ASME Journal of Biomechanical Engineering, 124, 441-449, 2002
  24. Farquhar, T., Zhou, J., and Meyer-Philips, H., “Rht1 dwarfing gene selectively decreases the material stiffness of wheat,” Journal of Biomechanics, 2002
  25. Zhou, D. G., and Zhou, J., “Optimization design of an axial-flow fan using for mining local-ventilation,” International Journal of Computers & Industrial Engineering, 31(3/4), 691-696, 1996
  26. Zhou, D. G., and Zhou, J., “Performance optimization and numerical computation of a low pressure axial-flow fan,” Journal of China Coal Society, Vol. 21, No. 1. 101-106, 1996
  27. Zhou, J., and Fukui, K., “A theoretical model for the coupling problem in the rock mass,” Journal of Shanxi Mining Institute, Vol. 13, No. 1. 76-81, 1995
  28. Liu, H. J. and Zhou, J., “The analysis of the arrangement of cutting teeth on the coal mining machine,” Journal of Shanxi Machinery, Vol. 2. 19-22, 1992
  29. Zhou, J., Zhou, D. G., and Hao, Z. X., “The design of an ultrasonic P. Langev,” Journal of Shanxi Mining Institute, Vol. 9, No. 3. 259-268. 1991
  30. Zhou, J., Zhang Z. Y., and Yang, Q. Z., “Ultrasonic non-destructive testing of concrete and the analyzing of its Results,” Journal of Shanxi Mining Institute, Vol. 9, No. 2, 122-127. 1991. 

Books and Book Chapters

  1. Zhou, J., and Tee, T.Y., “Chapter 7: Hygroscopic swelling of polymeric materials in electronic packaging: characterization and analysis,” In Fan and Suhir (eds) Moisture Sensitivity of Plastic Packages of IC Devices, Chapter 7: 153-179, Springer, 2010
  2. Zhou, J., Zhang, G.Q., and Chandra A., “Continuum theory in moisture-induced failure of encapsulated IC devices,” In Fan and Suhir (eds) Moisture Sensitivity of Plastic Packages of IC Devices, Chapter 11: 1279-299, Springer, 2010
  3. Fan XJ and Zhou, J., “Introduction to Advanced Mechanics,” In Zhang, G. Q., Van Driel, W. D. (eds) Mechanics of Microelectronics, Chapter 4: 95-167, Springer, 2006
  4. Zhang G. Q., van Driel, W. D., and Zhou, J., “Characterization and Modeling of Moisture Behavior,” In Zhang, G. Q., Van Driel, W. D. (eds) Mechanics of Microelectronics, Chapter 6: 281-375, Springer, 2006
  5. Farquhar, T., Zhou, J., and Haslach, H. W. Jr., “The Energetics of Crop Canopy Ventilation,” In FG Barth, JAC Humphrey, TW Secomb (eds.) Sensors and Sensing in Biology and Engineering, Chapter 15, Springer, 2003
  6. Zhou, J., “Constrained Optimization of the Dynamical Structural Performance of Triticum aestivum L.,” Ph.D. Dissertation, University of Maryland, Baltimore County, 2003
  7. Zhou, J. “A Study of Nondestructive Ultrasonic Test on a Nonmetal Material,” Master Thesis, Chongqing University, 1988

Peer-Reviewed Conference Proceedings  

  1. Zhu, WH, Zhuo, J., et al, “First Year Experience from RET Site: Incorporating Engineering Design and Manufacturing into High School Curriculum,” ASEE Annual Conference and Exhibition, Salt Lake City, UT, June 24-27, 2018
  2. Aung, K and Zhou J., “Critical Role and Educational importance of Design Competitions in Senior Capstone Design Course,” ASEE Annual Conference and Exhibition, Salt Lake City, UT, June 24-27, 2018
  3. Zhu, WH, Zhuo, J., et al, “Industrial and Mechanical Engineering Scholars with Scholarships, Career Mentoring, Outreach and Advisement, Professional Societies and Engineering Learning Community (SCOPE) S-STEM Program,” ASEE Annual Conference and Exhibition, Columbus, Ohio, June 25-28, 2017
  4. Fan JJ, Jiang CS, Zhou J, Qian C, Fan XJ, Zhang GQ and Pecht M. Fatigue Damage Assessment of LED Chip Scale Packages with Finite Element Simulation. The International Conference on Advances in Computational Mechanics. 2017
  5. Chen LB, Zhou J, Chu HW, Fan XJ. A Unified and Versatile Model Study for Moisture Diffusion. 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), Orlando, Florida. 30 May-2 June 2017
  6. Aung, K. and Zhou, J., “Critical Role of Computer Simulations in Teaching and Evaluating Thermal and Energy System Courses,” ASEE Annual Conference and Exhibition, New Orleans, Louisiana, June 26-29, 2016. (Third Best Paper Award)
  7. Sun B, Fan XJ, van Driel WD, Michel T, Zhou J, Zhang GQ, Lumen decay prediction in LED lamps, 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 18-20 April 2016
  8. Mohsenizadeh, M., and Zhou, J., “Kinematic Analysis and Simulation of Theo Jansen Mechanism,” 15th ASME ECTC Conference, Nov 7-8, 2015. (Best Paper Award)
  9. Aung, K. and Zhou, J., “Integration of Experiential Learning Modules in Sophomore and Junior Courses: A Pilot Study,” American Society of Engineering Education Zone III Meeting, Springfield, Missouri, September 23-25, 2015
  10. Zhou, J., Chu, H.W., and Li, X., “Simulation of the Standardized Drop Tests for Handheld Electronics Devices,” 2015 International Conference on Mechanical and Electrical Technology (ICEMT 2015), Bali, Indonesia, July 1-3, 2015
  11. Khan A. and Zhou J., “Injection Mold Optimization Based on Flow Analyses and Simulation,” ASME International Mechanical Engineering Congress and Exposition, IMECE2015-53231, Houston, Nov. 13-19, 2015
  12. Mohsenizadeh, M., and Zhou, J., “Synthesis and Simulation of a Walking Mechanism,” ASME International Mechanical Engineering Congress and Exposition, IMECE2015-52881, Houston, Nov. 13-19, 2015
  13. Kijkanjanapaiboon K, Kretschmer TW, Chen L, Fan XJ, and Zhou J., “LED’s luminous flux lifetime prediction using a hybrid numerical approach,” Proc. 12th. Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems. 2015
  14. Manchem, L. Divya, Sriniwassan, M., and Zhou J. “Analytical Modeling of Residual Stress in Railroad Rails Using Critically Refracted Longitudinal Ultrasonic Waves with COMSOL Multiphysics Module,” ASME International Mechanical Engineering Congress and Exposition, IMECE2014-38619, Montreal, Canada, November 14-20, 2014
  15. Kallolimath S., and Zhou J., “Determination of Optimal Shock Pulse in Drop Test Simulation of Standardized Board for Uniform Shock Response,” ASME Dynamic Systems and Control Conference (DSCC2014), October 22–24, San Antonio, Texas, 2014
  16. Kallolimath S., and Zhou J., “Simulation of Standardized Board for Uniform Impact Towards Optical Shock Pulse,” ASME International Mechanical Engineering Congress and Exposition, IMECE 2013-64729, San Diego, November 15-21, 2013
  17. Zhu, WH., Zhou J., Aminul Islam, Md. Abu Shufean, and Xinyu Liu “Development of a Mobile App for Learning System Dynamics,” IMECE 2013-62512, San Diego, November 15-21, 2013
  18. Li, X., Subbuswamy, G., and Zhou J., “Performance of Gas Turbine Film Cooling with Backward Injection,” The 5th Asia-Pacific Power and Energy Engineering Conference (APPEEC 2013), Beijing, China, July 12-14, 2013
  19. Zhou, J., “Simulation on the Evaluation of Residual Stress Using Critically Refracted Ultrasonic Longitudinal Waves,” ASME International Mechanical Engineering Congress and Exposition (IMECE 2012), Houston, Texas, November 9-15, 2012
  20. Kallolimath S., and Zhou J., “A Study on Dynamic Response in the Standardized Drop Test,” ASME International Mechanical Engineering Congress and Exposition (IMECE 2012), Houston, Texas, November 9-15, 2012
  21. Joshi, Shrijwal, Srinivasan M., and Zhou, J, “Development of a Numerical Model to Predict Residual Stress Based on Acoustoelastic Effect Using Critically Refracted Ultrasonic Longitudinal (LCR) Waves,” ASME International Mechanical Engineering Congress and Exposition (IMECE 2012), Houston, Texas, November 9-15, 2012
  22. Sanghadia, M., and Zhou J., “Control System Analysis for the DC Motors Used in Robotic Arms,” ASME International Mechanical Engineering Congress and Exposition (IMECE 2011), Denver, Colorado, November 11-17, 2011
  23. Desai, D., and Zhou J., “Optimization Design of an Axial-Flow Fan Used in Local Ventilation in Mining Industry,” ASME International Mechanical Engineering Congress and Exposition (IMECE 2011), Denver, Colorado, November 11-17, 2011
  24. Kallolimath S., and Zhou J., “A Study of the Input Profile in the Drop Test on the JEDEC Board,” ASME International Mechanical Engineering Congress and Exposition (IMECE 2011), Denver, Colorado, November 11-17, 2011
  25. Li, J. Zhou, “Getting Hands-on Experience from Simple Experiments and Model Development in Thermal/Fluid Courses,” ASME International Mechanical Engineering Congress and Exposition (IMECE 2011), Denver, Colorado, November 11-17, 2011
  26. Jiang Zhou and Sharan Kallolimath, “Simulation of the Standardized Drop Tests for Handheld Electronics Devices,” 2011 International Workshop on Computational Mechanics, Materials and Engineering Applications, July 23-24, 2011, Kunming , China
  27. Mihirkumar Sanghadia and Jiang Zhou, “Anthropometric Robotic Arm With DC Motor Control System Analysis,” ASEE GSW Annual Conference, Houston, TX, Mar. 9-11, 2011
  28. Harish Kale, Milind Ranade and Jiang Zhou, “Development of Web-Based Graphical User Interface for the Reponses of Dynamic Systems,” ASEE GSW Annual Conference, Houston, TX, Mar. 9-11, 2011
  29. Zhu, WH, Aung K., Zhou J., “Development and Analysis of 3D Haptic-augmented Learning Tools for Dynamics Course,” 2011 NSF CCLI-TUES CONFERENCE, Washington, D. C., January 26-28, 2011
  30. Donaga, S., Pushpa, KC., and Zhou, J, “Dynamic response of living grass-like crops,” Proceedings of ASME International Mechanical Engineering Congress and Exposition (IMECE 2010), Vancouver, Canada, November, 2010
  31. Zhu WH, Zhou J., and Aung K., “Design improvement and analysis on 3-D haptic augmented learning tools for dynamics course,” Proceedings of 2010 ASEE Annual Conference and Exhibition, Louisville, KY, June 20-23, 2010
  32. Li and J. Zhou, “Integration of Demo Experiments into Engineering Courses,” Proceedings of the Conference on High Education Development 2010,” Beijing, China, July 25-26, 2010
  33. Ranade M., and Zhou J., “Modeling and simulation of an active vehicle suspension system,” ASEE-GSW Annual Meeting, Lake Charles, LA, March 24-26, 2010
  34. Li, K. Aung, J. Zhou, “Incorporating Simple Classroom Demo Experiments to Enhance Teaching of Fluid Mechanics,” ASEE-GSW Annual Meeting, Lake Charles, LA, March 24-26, 2010
  35. Donaga, S., Zhou, J., and Yang Y., “Experimental study on the damping effect of grass-like crops,” Proceedings of ASME International Mechanical Engineering Congress and Exposition (IMECE 2009), Orlando, FL, November, 2009
  36. Zhou, J., Corder, P., Chu, H.W., and Aung, K., “Incorporating a research project into an undergraduate level course,” Proceedings of 2009 ASEE Annual Conference and Exhibition, Austin, TX, June 2009
  37. Zhou, J., Corder, P., Chu, H.W., and Li, X.C., “Development of visualization tools for dynamic systems with multiple degrees of freedom,” Proceedings of 2009 ASEE Annual Conference and Exhibition, Austin, TX, June 2009
  38. Zhu, W., Aung, K., and Zhou, J., “Development and analysis of 3D Haptic-augmented learning tools for dynamics course,” Proceedings of American Society of Engineering Education 2009 annual conference, June 14 ~ 17, Austin, TX
  39. Zhou, J., “Integrating a cutting edge research project in teaching system dynamics,” Proceedings of 2009 ASEE GSW Conference, Waco, March 2009
  40. Zhou, J., “Dynamics of drop impact test,” 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2009), Suzhou, China, July, 2009
  41. Zhou, J. and Farquhar T., “Constrained optimization of the dynamical structural performance of wheat,” Proceedings of 6th Plant Biomechanics Conference, Cayenne, French Guiana, November 2009
  42. Zhou, J., “Local buckling instability analysis of crop stem,” International Conference on Dynamics, Vibration and Control, Chendu, China, August, 2009
  43. Donaga, S. and Zhou, J., “Damping effect of living grass-like crops,” ASME ECTC conference, Arlington, TX, April, 2009
  44. Zhou, J., “A study on the effect of input impact profile in drop test,” IEEE 10th Electronic Packaging Technology Conference (EPTC), Singapore, Dec.9 – Dec. 12, 2008,
  45. Fan, X., Zhou J. and Chandra, A., “Package structural integrity analysis considering moisture,”  IEEE Electronic Components and Technology Conference (ECTC), p 1054-1066, 2008
  46. Zhou J., Paul Corder, Weihang Zhu, Kendrick Aung, Direct Assessment of Course Outcomes II: Results and Continuing Improvement for Mechanical Engineering Courses, ASME IMECE 2008-67421, Boston, MA, USA
  47. Zhu, W. H., Aung, K., Zhou J., and Srinivasan, M., “A Study of the Impact of 3D Haptic-augmented Learning Tools on Dynamics Course,” Proceedings of 2008 ASME International Mechanical Engineering Congress and Exposition (IMECE), Boston, MA, Oct. 31 – Nov. 5, 2008
  48. Zhou, J., “Analytical analysis on the effect of time duration of acceleration pulse to a JEDEC board in drop test,” Proceedings of International Conference on Electronic Packing Technology , ICEPT, 2008
  49. Aung, K., Zhou, J., and Li, X. C., “Engineering mathematics for mechanical engineering students: bridging the knowledge gap,” Proceedings of ASEE Annual Conference and Exhibition, 2008
  50. Li, X. C., Aung, K., and Zhou, J., “Teaching enhancement in undergraduate thermodynamics II,” Proceedings of 2008 ASEE Annual Conference and Exhibition, Pittsburgh, PA, June 2008
  51. Patel, M., and Zhou J., “Study of time and temperature dependency of bulk modulus for molding compound by transit bulk creep experiments,” Proceedings of ASME International Mechanical Engineering Congress and Exposition, IMECE 2007 , v 5, p 275-279, 2007
  52. Zhou, J., R. P. Niraula and K. Aung., “Analysis on the effect of input impact profiles in drop test,” Proceedings of ASME International Mechanical Engineering Congress and Exposition, IMECE 2007 , v 5, p 223-231, 2007
  53. Zhou, J., Aung, K., and Corder P., “Direct assessment of course outcomes: Strategies and implementations for mechanical engineering courses,” Proceedings of ASME International Mechanical Engineering Congress and Exposition, IMECE 2007 , v 7, p 15-22, 2007
  54. Li, X., and Zhou, J., and Aung, K., “On selection of reference temperature of heat transfer coefficient for complicated flows,” ASME-JSME Thermal Engineering and ASME Summer Heat Transfer Conference (AJTEC/SHTC), Vancouver, Canada. July 8-12, 2007
  55. Jansen K. M. B., Patel M. D, and Zhou, J., “PVT measurements and bulk modulus study of Epoxy molding compound,” Proceedings of ASME Applied Mechanics and Materials Conference (McMat), Austin, TX, June, 2007
  56. Zhou J., R. P. Niraula and P. Corder., “Block-diagram based SIMULINK analysis for the drop impact response of a mobile electronic system,” IEEE International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems(EuroSimE), London, England, April 2007
  57. Corder, P., Zhou, J., and Aung, K., “Senior Design and US Space Program, and its Assessment,” Proceedings of 2007 ASEE Annual Conference and Exhibition, Honolulu, Hawaiian, June 2007
  58. Zhou, J., Corder, P., and Aung, K., “Teaching of Dynamic Systems with Integrated Analytical and Numerical Method,” Proceedings of 2007 ASEE Annual Conference and Exhibition, Honolulu, Hawaiian, June 2007
  59. Adhikari, M., Niraula, R. D., and Zhou, J., “Development of MATLAB Graphic User Interfaces for response of dynamic systems,” Proceedings of ASME Graduate Student Research & Innovations Conference (GSRIC), Tulsa, Oklahoma, April 2007
  60. Niraula, R. D., Adhikari, M., and Zhou, J., “Simulink models for the impact response of a mobile electronic system,” Proceedings of ASME Graduate Student Research & Innovations Conference (GSRIC), Tulsa, Oklahoma, April 2007
  61. Zhou, J., “Analytical and numerical bound analysis of hygroscopic swelling characterization,” IEEE Electronic Components and Technology Conference (ECTC), May 31-June 4, 2006, San Diego, CA. pp. 734-739
  62. Lahoti, S., Kallolimath S., and Zhou, J., “Reliability assessment of an electronic package subjected to thermal and moisture loading,” Intersociety Conference for Thermal and Thermomechanical Phenomena in Electronic Systems (Itherm), San Diego, CA, May 30 – June 2, 2006, pp. 1049-1055
  63. Kallolimath S., and Lahoti, S., and Zhou, J., “Dynamic response of a portable electronic product subjected to an impact load,” Intersociety Conference for Thermal and Thermomechanical Phenomena in Electronic Systems (Itherm), San Diego, CA, May 30 – June 2, 2006
  64. Zhou, J., “Sequentially-coupled finite element transient analysis on hygroscopic swelling characterization,” IEEE International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems(EuroSimE), April 17-20, 2006, Milan, Italy, pp. 261 - 266
  65. Zhou, J., “Analytical and numerical analysis of drop impact behavior for a portable electronic device,” IEEE International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems(EuroSimE), April 17-20, 2006, Milan, Italy, pp 138 – 144
  66. Kallolimath S., Lahoti, S., and Zhou, J., “Board level analysis on the drop impact of a mobile phone” ASME International North American District E Graduate Student Conference, Fayetteville, Arkansas, April 6-8, 2006
  67. Zhang, X., and Zhou, J., “Theoretical Analysis in characterizing hygroscopic swelling of polymeric materials” ASME International North American District E Graduate Student Conference, Fayetteville, Arkansas, April 6-8, 2006
  68. Zhou, J., Tee, T. Y, Luan, J., and Zhang, X. R., “Characterization and modeling of hygroscopic swelling and its impact on failures of a flip chip Package with no-flow underfill,” IEEE 7th Electronic Packaging Technology Conference (EPTC), Dec. 7 – Dec. 9, 2005, Singapore, pp 561-568
  69. Lahoti, S., Kallolimath S., and Zhou, J., “FEM Analysis of thermo-hydro-mechanical failure of a FCBGA Package,” Proceedings of 6th International Conference on Electronic Packing Technology (ICEPT), Aug. 30 – Sept. 2, 2005, Shenzhen, China, pp 343 - 351
  70. J. E., Tee, T. Y., and Zhou, J., “Dynamic response of PCB subassembly subjected to an impact load,” 38th International Symposium on Microelectronics (IMAPS), September 25-29, 2005, Philadelphia, Pennsylvania, pp 673 – 684
  71. Zhou, J., Zhang, X. Q., Tee, T. Y. and Luan. J, “Upper and Lower Bound Theoretical Analysis in Characterizing Hygroscopic Swelling of Polymeric Materials,” 38th International Symposium on Microelectronics (IMAPS), September 25-29, 2005, Philadelphia, Pennsylvania, pp 753 - 760
  72. Zhou, J., Tee, T. Y., and X. Zhang, “Transient analysis on hygroscopic swelling characterization using sequentially coupled moisture diffusion and hygroscopic stress modeling approach,” Proceedings of ASME International Mechanical Engineering Congress and Rd & D Expo (IMECE), November 5-11, 2005,Orlando, Florida, pp 107 - 114
  73. J., “Dynamic response of a portable electronic product subjected to an impact load,” ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packing MEMS, NMES, and Electronic System, InterPACK’05, July 17-22, 2005, San Francisco, California
  74. J., Lahoti, S., and Kallolimath K., “Investigation of inner-layer dielectric (ILD) failure by hygroscopic swelling,” IEEE Electronic Components and Technology Conference (ECTC), May 31-June 4, 2005, Orlando, Florida, pp 1254 - 1260
  75. J., Lahoti, S., and Kallolimath K., “Investigation of non-uniform moisture distribution on determination of hygroscopic swelling coefficient and finite element modeling for a flip chip package,” IEEE International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE), April 17-20, 2005, Berlin, Germany, pp 112-119
  76. Sitlani, M, Lahoti, S., and Zhou, J., “Modeling of hygroscopic swelling and its impact on ILD/UMB failure for a flip-chip package,” ASME Great International Southwest Region X Graduate Student Technical Conference, April 1-2, 2005, Lubbock, Texas
  77. Zhang, X. and Zhou, J., “Buckling and instability analysis on carbon nanotubes,” ASME Great International Southwest Region X Graduate Student Technical Conference, April 1-2, 2005, Lubbock, Texas
  78. Zhou, J., and Farquhar, T., “New criterion for local buckling and brazier collapse on an orthotropic thin wall tubular beam of arbitrary length,” Proceedings of ASME International Mechanical Engineering Congress and Rd & D Expo, November 13-19, 2004, Anaheim, California, pp768 - 776
  79. Zhou, J., and Farquhar, T., “Reference basis model updating method applied to vibrating wheat,” Proceedings of the SEM Annual Conference on Experimental and Applied Mechanics. June 10 - 12. Milwaukee, Wisconsin. 2002
  80. Zhou, J., “Mechanical behaviors for rock mass considering water flow and heat transfer,” Proceedings of IMMM'95, International Academic Publisher, 251-256. 1995
  81. Zhou, J. and Sato, Y., “A study on coupled stress and fluid flow analysis,” International Symposium o New Development of Rock Mechanics & Engineering, 755-764, October 10-12, Shenyang, China, 1994.
  82. Zhou, J. and Sato, Y., “Analytical and numerical analysis on the hydro-mechanical stress in rock masses,” Proceeding of 5th Conference on Rock Mechanics in China, 255-261. October, Chongqing, China, 1994
  83. Zhou, J. “The mathematical model of the coupling of seepage, temperature and stress,” Proceeding of Conference on Rock Mechanics and its Applications for Chinese Young Scholars,” 131-135, Wuhan, China, December, 1994